| Product |
Application |
Viscosity@25'c |
TI |
Recommended Cure Condition |
TDS |
MSDS |
| IB-9000(M140-3) |
DA adhesive for LED |
20,000 cps |
1.6 |
Convection Oven 40m @ 160°C |
File1 |
File2 |
| IB-9000(M140-3) |
DA adhesive for LED |
27,000 cps |
2.1 |
Convection Oven 40m @ 160°C |
File1 |
File2 |
| BA-1603 |
B-stage DA for Semicon PKG |
27,000 cps |
3.5 |
B-stage cure : 30m @ 125°C + Post cure : 30m @ 175°C |
File1 |
File2 |
| BA-1604B |
B-stage DA for Semicon PKG |
13,000 cps |
3.5 |
B-stage cure : 30m @ 125°C + Post cure : 30m @ 175°C |
File1 |
File2 |
| AD-1620 |
Microspeaker bonding |
67,000 cps |
1.1 |
Convection Oven 30m @ 80℃ or Hot Plate 2m @ 120℃ |
File1 |
File2 |
| CB-6506 |
Chip bonding adhesive |
150,000 cps |
5.3 |
Reflow Oven 80s @ 150℃ |
File1 |
File2 |
| CB-6520 |
Chip bonding adhesive |
100,000 cps |
7.0 |
Reflow Oven 4m @ 150℃ or Hot Plate 90s @ 150℃ |
File1 |
File2 |
| CB-6590 |
Chip bonding adhesive |
115,000 cps |
6.4 |
Reflow Oven 90s @ 150℃ |
File1 |
File2 |
| CB-6520P |
Chip bonding adhesive |
145,000 cps |
5.3 |
Reflow Oven 90s @ 150℃ |
File1 |
File2 |
| UV-3083H |
Bonding / Sealing for OLED panel |
400 cps |
1.0 |
365nm LED 3,000mJ |
File1 |
File2 |
| UV-3083V |
Bonding / Sealing for OLED panel |
220 cps |
1.0 |
365nm LED 3,000mJ |
File1 |
File2 |
| UV-3231C |
Bonding / Sealing for OLED panel |
500 cps |
1.0 |
365nm LED 3,000mJ |
File1 |
File2 |
| UV-3231LB |
Bonding / Sealing for LCD panel |
760 cps |
1.0 |
365nm LED 3,000mJ |
File1 |
File2 |
| UV-6103 |
Bonding / Sealing for LCD panel |
2,700 cps |
1.1 |
365nm LED 3,000mJ |
File1 |
File2 |
| UV-6103M |
Bonding / Sealing for LCD panel |
2,300 cps |
1.0 |
365nm LED 3,000mJ |
File1 |
File2 |
