Product Product

Product DA-4001G
Application Image sensor die attach bonding
Recommended Cure Condition Convection Oven 5m @ 150℃ or Hot Plate 2m @ 120℃
Viscosity 20,000 cps
File MATT DA-4001G TDS_Rev.B.pdf
MATT DA-4001G MSDS ENG_Rev.D.pdf
Description High modulus, Good Adhesion