| Product | UFC-2801 |
|---|---|
| Application | Underfill for Flipchip package |
| Recommended Cure Condition | Convection Oven 40m @ 125°C |
| Viscosity | 8,000 cps |
| File | |
| Description | High reliability, Low RBO, Fast Flow |
| Product | UFC-2801 |
|---|---|
| Application | Underfill for Flipchip package |
| Recommended Cure Condition | Convection Oven 40m @ 125°C |
| Viscosity | 8,000 cps |
| File | |
| Description | High reliability, Low RBO, Fast Flow |