| Product | UFC-2740B |
|---|---|
| Application | Underfill for Flipchip package |
| Recommended Cure Condition | Convection Oven 30m @ 150°C |
| Viscosity | 8,000 cps |
| File | |
| Description | High reliability, Low RBO, Fast Flow |
| Product | UFC-2740B |
|---|---|
| Application | Underfill for Flipchip package |
| Recommended Cure Condition | Convection Oven 30m @ 150°C |
| Viscosity | 8,000 cps |
| File | |
| Description | High reliability, Low RBO, Fast Flow |