| Product | UF-2230 |
|---|---|
| Application | Underfill for BGA/CSP/WL-CSP |
| Recommended Cure Condition | Convection Oven 15m @ 130°C |
| Viscosity | 330 cps |
| File | |
| Description | Reworkable, Very low viscosity, Fast Flow |
| Product | UF-2230 |
|---|---|
| Application | Underfill for BGA/CSP/WL-CSP |
| Recommended Cure Condition | Convection Oven 15m @ 130°C |
| Viscosity | 330 cps |
| File | |
| Description | Reworkable, Very low viscosity, Fast Flow |