| Product | UF-2082 |
|---|---|
| Application | Underfill for BGA/CSP/WL-CSP |
| Recommended Cure Condition | Convection Oven 15m @ 150℃ or Reflow Oven 8m @ 130℃ or Reflow Oven 8m @ 140℃ |
| Viscosity | 1,000 cps (20rpm) |
| File | |
| Description | Mid Tg, Fast Flow |
| Product | UF-2082 |
|---|---|
| Application | Underfill for BGA/CSP/WL-CSP |
| Recommended Cure Condition | Convection Oven 15m @ 150℃ or Reflow Oven 8m @ 130℃ or Reflow Oven 8m @ 140℃ |
| Viscosity | 1,000 cps (20rpm) |
| File | |
| Description | Mid Tg, Fast Flow |