Product Product

Product UF-1083C
Application Underfill for BGA/CSP/WL-CSP
Recommended Cure Condition Convection Oven 30m @ 95℃ or Convection Oven 15m @ 125℃ or Reflow Oven 5m @ 150℃
Viscosity 1,300 cps (20rpm)
File MATT UF-1083C TDS_Rev.E.pdf
MATT UF-1083C MSDS ENG_Rev.G.pdf
Description Clear version of UF-1083