| Product |
Application |
Viscosity@25'c |
TI |
Recommended Cure Condition |
TDS |
MSDS |
| AD-1375HW |
Fixtuer bonding |
20,000 cps |
5.5 |
Convection Oven 30m @ 70℃ or Hot Plate 150s @ 70℃ |
File1 |
File2 |
| AD-1620 |
Fixtuer bonding |
67,000 cps |
1.1 |
Convection Oven 30m @ 80℃ or Hot Plate 120s @ 120℃ |
File1 |
File2 |
| TU-1930 |
Fixtuer bonding |
1,350 cps (20rpm) |
0.8 |
Convection Oven 30m @ 85℃ or Hot Plate 2m @ 120℃ |
File1 |
File2 |
| UC-3216 |
Fixtuer bonding |
4,000 cps |
2.0 |
365nm LED 3,000mJ |
File1 |
File2 |
| DA-4051L |
Sensor die attach bonding |
8,000 cps |
3.8 |
Hot Plate 2m @ 120℃ |
File1 |
File2 |
| DA-4051FC |
Sensor die attach bonding |
17,500 cps |
5.5 |
Hot Plate 2m @ 100℃ |
File1 |
File2 |
| UF-1083 |
Underfill for BGA/CSP/WL-CSP |
1,300 cps (20rpm) |
1.0 |
Convection Oven 30m @ 95℃ or Convection Oven 15m @ 125℃ or Reflow Oven 5m @ 150℃ |
File1 |
File2 |
| UF-1083C |
Underfill for BGA/CSP/WL-CSP |
1,300 cps (20rpm) |
1.0 |
Convection Oven 30m @ 95℃ or Convection Oven 15m @ 125℃ or Reflow Oven 5m @ 150℃ |
File1 |
File2 |
| UF-2082 |
Underfill for BGA/CSP/WL-CSP |
1,000 cps (20rpm) |
1.0 |
Convection Oven 15m @ 150℃ or Reflow Oven 8m @ 130℃ or Reflow Oven 8m @ 140℃ |
File1 |
File2 |
| UF-2030T2-2 |
Underfill for BGA/CSP/WL-CSP |
1,100 cps |
1.0 |
Convection Oven 20m @ 140°C |
File1 |
File2 |
| UF-2230 |
Underfill for BGA/CSP/WL-CSP |
330 cps |
0.7 |
Convection Oven 15m @ 130°C |
File1 |
File2 |
| UFC-2740B |
Underfill for Flipchip package |
8,000 cps |
1.1 |
Convection Oven 30m @ 150°C |
File1 |
File2 |
| UFC-2801 |
Underfill for Flipchip package |
8,000 cps |
1.0 |
Convection Oven 40m @ 125°C |
File1 |
File2 |
| UFC-2803 |
Underfill for Flipchip package |
11,000 cps |
1.0 |
Convection Oven 10m @ 165°C |
File1 |
File2 |
| FL-5060 |
Liguid Encapsulant |
50,000 cps |
1.3 |
Convection Oven 10m @ 70°C |
File1 |
File2 |
